Test and Pack to Tray Machine

Electronic Components Processing

This is one of a family of machines developed for the processing of surface mount hybrid components.

The machine takes a real of components supplied on a lead frame, removing them from the lead frame, cutting the legs to length, functionally testing the component and packing the component into a vacuum formed tray.

Other variants of the machine include a bandolier packing version and a combined tray and bandolier unit.

  • Do you process and/or pack electronic components ?
  • Want to increase output ?
  • Improve quality ?
  • Reduce costs ?

 

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